High fill-factor efficient vertical-cavity surface emitting laser arrays
WANG, CHAD; GESKE, JONATHAN
2013-09-17
著作权人FLIR SYSTEMS, INC.
专利号US8537874
国家美国
文献子类授权发明
其他题名High fill-factor efficient vertical-cavity surface emitting laser arrays
英文摘要An array of vertical-cavity surface emitting lasers (VCSELs) may be fabricated with very high fill-factors, thereby enabling very high output power densities during pulse, quasi-continuous wave (QCW), and continuous wave (CW) operation. This high fill-factor is achieved using asymmetrical pillars in a rectangular packing scheme as opposed prior art pillar shapes and packing schemes. The use of asymmetrical pillars maintains high efficiency operation of VCSELs by maintaining minimal current injection distance from the metal contacts to the laser active region and by maintaining efficient waste heat extraction from the VCSEL. This packing scheme for very high fill-factor VCSEL arrays is directly applicable for next generation high-power, substrate removed, VCSEL arrays.
公开日期2013-09-17
申请日期2010-10-28
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/49945]  
专题半导体激光器专利数据库
作者单位FLIR SYSTEMS, INC.
推荐引用方式
GB/T 7714
WANG, CHAD,GESKE, JONATHAN. High fill-factor efficient vertical-cavity surface emitting laser arrays. US8537874. 2013-09-17.
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