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Influence of Dealloying Solution on the Microstructure of Monolithic Nanoporous Copper through Chemical Dealloying of Al 30 at.% Cu Alloy
Liu, Wenbo; Zhang, Shichao; Li, Ning; Zheng, Jiwei; An, Shenshen; Li, Guangxing
刊名INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE
2012
卷号7页码:7993-8006
关键词Nanoporous copper Dealloying Corrosion media Microstructure Surface diffusivity
ISSN号1452-3981
URL标识查看原文
收录类别SCIE
WOS记录号WOS:000309206900021
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/6579152
专题北京航空航天大学
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GB/T 7714
Liu, Wenbo,Zhang, Shichao,Li, Ning,et al. Influence of Dealloying Solution on the Microstructure of Monolithic Nanoporous Copper through Chemical Dealloying of Al 30 at.% Cu Alloy[J]. INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE,2012,7:7993-8006.
APA Liu, Wenbo,Zhang, Shichao,Li, Ning,Zheng, Jiwei,An, Shenshen,&Li, Guangxing.(2012).Influence of Dealloying Solution on the Microstructure of Monolithic Nanoporous Copper through Chemical Dealloying of Al 30 at.% Cu Alloy.INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE,7,7993-8006.
MLA Liu, Wenbo,et al."Influence of Dealloying Solution on the Microstructure of Monolithic Nanoporous Copper through Chemical Dealloying of Al 30 at.% Cu Alloy".INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE 7(2012):7993-8006.
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