| Enhanced adhesion and conductivity of Cu electrode on AlN substrate for thin film thermoelectric device | |
| Hu, Shaoxiong; Chen, Xin; Deng, Yuan; Wang, Yao; Gao, Hongli; Zhu, Wei; Cao, Lili; Luo, Bingwei; Zhu, Zhixiang; Ma, Guang | |
| 刊名 | FUNCTIONAL MATERIALS LETTERS
 |
| 2015 | |
| 卷号 | 8 |
| 关键词 | Copper AlN substrate thin film electrode adhesion magnetron sputtering |
| ISSN号 | 1793-6047 |
| DOI | 10.1142/S1793604715500320 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| WOS记录号 | WOS:000360121300004 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6539068 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Hu, Shaoxiong,Chen, Xin,Deng, Yuan,et al. Enhanced adhesion and conductivity of Cu electrode on AlN substrate for thin film thermoelectric device[J]. FUNCTIONAL MATERIALS LETTERS,2015,8. |
| APA | Hu, Shaoxiong.,Chen, Xin.,Deng, Yuan.,Wang, Yao.,Gao, Hongli.,...&Han, Yu.(2015).Enhanced adhesion and conductivity of Cu electrode on AlN substrate for thin film thermoelectric device.FUNCTIONAL MATERIALS LETTERS,8. |
| MLA | Hu, Shaoxiong,et al."Enhanced adhesion and conductivity of Cu electrode on AlN substrate for thin film thermoelectric device".FUNCTIONAL MATERIALS LETTERS 8(2015). |
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