| Failure Analysis of Au-Al Wire Bonding to MOSFETs | |
| JiaoyingHuang; CanCui; ChengGao; YuanyuanXiong | |
| 2015 | |
| 会议名称 | PROCEEDINGS OF THE 4TH INTERNATIONAL CONFERENCE ON MECHATRONICS, MATERIALS, CHEMISTRY AND COMPUTER ENGINEERING 2015 (ICMMCCE 2015) |
| 会议日期 | 2015-01-01 |
| 关键词 | Failure analysis MOSFET Au-Al wire bonding reliability bonding strength |
| 卷号 | 39 |
| 页码 | 2563-2569 |
| 收录类别 | CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000373157302118 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6537075 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | JiaoyingHuang,CanCui,ChengGao,et al. Failure Analysis of Au-Al Wire Bonding to MOSFETs[C]. 见:PROCEEDINGS OF THE 4TH INTERNATIONAL CONFERENCE ON MECHATRONICS, MATERIALS, CHEMISTRY AND COMPUTER ENGINEERING 2015 (ICMMCCE 2015). 2015-01-01. |
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