High-frequency characterization of packaging network in to-can photodiode modules

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	High-frequency characterization of packaging network in to-can photodiode modules
	Zhu, NH ; Wen, JM ; Zhang, SJ
刊名	microwave and optical technology letters
	2008
卷号	50 期号:5 页码:1219-1223
关键词	equivalent circuits scattering-parameters measurement test fixture calibration photodiode through hole (TO) packaging
ISSN号	0895-2477
通讯作者	zhu, nh, chinese acad sci, inst semicond, state key lab integrated opetoelect, pob 912, beijing 100083, peoples r china. 电子邮箱地址: nhzhu@semi.ac.cn
中文摘要	a simple method for analyzing the effects of to packaging network on the high-frequency response of photodiode modules is presented. this method is established based on the relations of the scattering parameters of the packaging network, photodiode chip, and module. it is shown that the results obtained by this method agree well with those obtained by the conventional comparison method. the proposed method is much more convenient since only the electrical domain measurements are required. (c) 2008 wiley periodicals, inc.
学科主题	光电子学
收录类别	SCI
语种	英语
公开日期	2010-03-08
内容类型	期刊论文
源URL	[http://ir.semi.ac.cn/handle/172111/6732]
专题	半导体研究所_中国科学院半导体研究所（2009年前）
推荐引用方式 GB/T 7714	Zhu, NH,Wen, JM,Zhang, SJ. High-frequency characterization of packaging network in to-can photodiode modules[J]. microwave and optical technology letters,2008,50(5):1219-1223.
APA	Zhu, NH,Wen, JM,&Zhang, SJ.(2008).High-frequency characterization of packaging network in to-can photodiode modules.microwave and optical technology letters,50(5),1219-1223.
MLA	Zhu, NH,et al."High-frequency characterization of packaging network in to-can photodiode modules".microwave and optical technology letters 50.5(2008):1219-1223.