| Numerical Study on the Stress-Strain Cycle of Thermal Self-Compressing Bonding | |
| Deng, Yun-Hua; Guan, Qiao; Tao, Jun; Wu, Bing | |
| 刊名 | CHINESE JOURNAL OF MECHANICAL ENGINEERING
 |
| 2018 | |
| 卷号 | 31 |
| 关键词 | Thermal self-compressing bonding Locally non-melted heating Thermal elasto-plastic stress-strain Atom diffusion Solid-state bonding Finite element analysis |
| ISSN号 | 1000-9345 |
| DOI | 10.1186/s10033-018-0266-x |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; CSCD |
| WOS记录号 | WOS:000442267700001 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5930643 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Deng, Yun-Hua,Guan, Qiao,Tao, Jun,et al. Numerical Study on the Stress-Strain Cycle of Thermal Self-Compressing Bonding[J]. CHINESE JOURNAL OF MECHANICAL ENGINEERING,2018,31. |
| APA | Deng, Yun-Hua,Guan, Qiao,Tao, Jun,&Wu, Bing.(2018).Numerical Study on the Stress-Strain Cycle of Thermal Self-Compressing Bonding.CHINESE JOURNAL OF MECHANICAL ENGINEERING,31. |
| MLA | Deng, Yun-Hua,et al."Numerical Study on the Stress-Strain Cycle of Thermal Self-Compressing Bonding".CHINESE JOURNAL OF MECHANICAL ENGINEERING 31(2018). |
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