| Superhydrophobic sol-gel films based on copper wafer and its anti-corrosive properties | |
| Fan Youhua*; Li Changzhu; Chen Zejun; Chen Hong | |
| 2012 | |
| 会议名称 | 2nd International Conference on Chemical Engineering and Advanced Materials, CEAM 2012 |
| 会议日期 | July 13, 2012 - July 15, 2012 |
| 会议地点 | Guangzhou, China |
| 关键词 | Superhydrophobic copper wafer sol gel deposition anti-corrosive properties |
| 卷号 | 557-559 |
| DOI | 10.4028/www.scientific.net/AMR.557-559.1777 |
| 页码 | 1777-1781 |
| 会议录 | ADVANCED MATERIALS AND PROCESSES II, PTS 1-3
 |
| URL标识 | 查看原文 |
| ISSN号 | 1022-6680 |
| WOS记录号 | WOS:000319300001030;EI:20124215568027 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5731663 |
| 专题 | 中南林业科技大学 |
| 作者单位 | [Fan Youhua] Cent S Univ, Inst Powder Met, Changsha 410083, Hunan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Fan Youhua*,Li Changzhu,Chen Zejun,et al. Superhydrophobic sol-gel films based on copper wafer and its anti-corrosive properties[C]. 见:2nd International Conference on Chemical Engineering and Advanced Materials, CEAM 2012. Guangzhou, China. July 13, 2012 - July 15, 2012. |
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