QQ客服 官方微博 反馈留言

	Modeling the Minimum Chip Thickness in Orthogonal Micro-cutting Based on Plastic Strain Gradient
	Wu, J. H.; Liu, Z. Q.
刊名	ULTRA-PRECISION MACHINING TECHNOLOGIES
	2009
卷号	69-70页码:203-208
关键词	Minimum chip thickness Strain gradient Micro-cutting Cutting force
DOI	10.4028/www.scientific.net/AMR.69-70.203
会议名称	8th China-Japan International Conference on Ultra-Precision Machining
URL标识	查看原文
会议日期	NOV 24-25, 2008
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5528573
专题	山东大学
作者单位	Shandong Univ, Sch Mech Engn, Jinan 250100, Peoples R China.
推荐引用方式 GB/T 7714	Wu, J. H.,Liu, Z. Q.. Modeling the Minimum Chip Thickness in Orthogonal Micro-cutting Based on Plastic Strain Gradient[J]. ULTRA-PRECISION MACHINING TECHNOLOGIES,2009,69-70:203-208.
APA	Wu, J. H.,&Liu, Z. Q..(2009).Modeling the Minimum Chip Thickness in Orthogonal Micro-cutting Based on Plastic Strain Gradient.ULTRA-PRECISION MACHINING TECHNOLOGIES,69-70,203-208.
MLA	Wu, J. H.,et al."Modeling the Minimum Chip Thickness in Orthogonal Micro-cutting Based on Plastic Strain Gradient".ULTRA-PRECISION MACHINING TECHNOLOGIES 69-70(2009):203-208.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。