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	Dynamic scanning electromagnetic infrared thermographic analysis based on blind source separation for industrial metallic damage evaluation
	He, Y.; Yang, R.; Wu, X.; Huang, S.
刊名	IEEE Transactions on Industrial Informatics
	2018
卷号	Vol.14 No.12页码:5610-5619
关键词	Blind source separation (BSS) dynamic scanning thermography electromagnetic thermography industrial inspection nondestructive testing (NDT) thermographic analysis time to half max
ISSN号	1551-3203
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5468857
专题	湖南大学
作者单位	1.a College of Electrical and Information Engineering, Hunan University, Changsha, 410006, China 2.Fujian Province University Key Laboratory of Nondestructive Testing, Fuqing Branch, Fujian Normal University, Fuzhou, 350108, China 3.College of Civil Engineering, Changsha University, Changsha, 410003, China
推荐引用方式 GB/T 7714	He, Y.,Yang, R.,Wu, X.,et al. Dynamic scanning electromagnetic infrared thermographic analysis based on blind source separation for industrial metallic damage evaluation[J]. IEEE Transactions on Industrial Informatics,2018,Vol.14 No.12:5610-5619.
APA	He, Y.,Yang, R.,Wu, X.,&Huang, S..(2018).Dynamic scanning electromagnetic infrared thermographic analysis based on blind source separation for industrial metallic damage evaluation.IEEE Transactions on Industrial Informatics,Vol.14 No.12,5610-5619.
MLA	He, Y.,et al."Dynamic scanning electromagnetic infrared thermographic analysis based on blind source separation for industrial metallic damage evaluation".IEEE Transactions on Industrial Informatics Vol.14 No.12(2018):5610-5619.

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