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	183-GHz Frequency Selective Surface Using Aligned Eight-Layer Microstructure
	Shen, Yihuan; Chen, Di; Wei, Qian; Lin, Shujing; Shi, Liyun; Wu, Linsheng; Guo, Ge
刊名	IEEE ELECTRON DEVICE LETTERS
	2018
卷号	Vol.39 No.10页码:1612-1615
关键词	Aligned packaging frequency selective surface (FSS) multi-layer
ISSN号	0741-3106
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5458730
专题	湖南大学
作者单位	1.Shanghai Jiao Tong Univ, Sch Elect Informat & Elect Engn, Key Lab Thin Film & Microfabricat Technol, Minist Educ, Shanghai 200240, Peoples R China 2.Shanghai Engn Res Ctr Intelligent Diag & Treatmen, Shanghai 200240, Peoples R China 3.Shanghai Jiao Tong Univ, Sch Elect Informat & Elect Engn, Minist Educ Design & EMC High Speed Elect Syst, Key Lab, Shanghai 200240, Peoples R China
推荐引用方式 GB/T 7714	Shen, Yihuan,Chen, Di,Wei, Qian,et al. 183-GHz Frequency Selective Surface Using Aligned Eight-Layer Microstructure[J]. IEEE ELECTRON DEVICE LETTERS,2018,Vol.39 No.10:1612-1615.
APA	Shen, Yihuan.,Chen, Di.,Wei, Qian.,Lin, Shujing.,Shi, Liyun.,...&Guo, Ge.(2018).183-GHz Frequency Selective Surface Using Aligned Eight-Layer Microstructure.IEEE ELECTRON DEVICE LETTERS,Vol.39 No.10,1612-1615.
MLA	Shen, Yihuan,et al."183-GHz Frequency Selective Surface Using Aligned Eight-Layer Microstructure".IEEE ELECTRON DEVICE LETTERS Vol.39 No.10(2018):1612-1615.

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