| Failure Analysis and Improvement of the Body Diode in Superjunction Power MOSFET | |
| Min Ren; Mengqi Yang; Shengrong Zhong; Chi Xie; Zehong Li; Wei Gao; Jinping Zhang; Bo Zhang | |
| 会议名称 | 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| 会议日期 | 2018 |
| 会议地点 | Singapore, Singapore |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5450790 |
| 专题 | 湖南大学 |
| 推荐引用方式 GB/T 7714 | Min Ren,Mengqi Yang,Shengrong Zhong,et al. Failure Analysis and Improvement of the Body Diode in Superjunction Power MOSFET[C]. 见:2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). Singapore, Singapore. 2018. |
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