Method of producing a semiconductor laser
SATO, KIYOTAKA; TOGURA, KENJI
1994-11-15
著作权人CLARION CO. LTD.
专利号US5365537
国家美国
文献子类授权发明
其他题名Method of producing a semiconductor laser
英文摘要A semiconductor substrate is coated with an insulation mask. A window is cut in the mask using photolithography leaving stress risers at locations defining the length of a laser cavity. A plurality of layers of semiconductor film are selectively grown over the exposed substrate to form a pin diode and necessary impurities are injected. An intrinsic layer of the film forms a laser excitation layer and emits laser beams in response to excitation. Following heat treatment, the device is cooled rapidly, causing stress in the areas where the stress risers from the mask join the semiconductor film. By the time the device reaches room temperature, the semiconductor film is split and separated by cleavage planes. Alignment of the semiconductor laser device output beams is produced by anisotropic etching of the cleavage planes to form 45 DEG mirror planes. Conventional photolithographic techniques permit formation of the laser resonator with an accuracy on the order of submicrons.
公开日期1994-11-15
申请日期1993-01-07
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/39110]  
专题半导体激光器专利数据库
作者单位CLARION CO. LTD.
推荐引用方式
GB/T 7714
SATO, KIYOTAKA,TOGURA, KENJI. Method of producing a semiconductor laser. US5365537. 1994-11-15.
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