Method for making semiconductor chips having coated portions
MCCOLLOCH, LAURENCE RAY
2010-08-31
著作权人AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
专利号US7785924
国家美国
文献子类授权发明
其他题名Method for making semiconductor chips having coated portions
英文摘要A method for making semiconductor chips having coated portions can include mounting the chips in lead frames, stacking the lead frames in an orientation in which a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating, and depositing a coating on the stacked lead frames using, for example, an evaporative coating machine. In this manner, the coating is deposited on exposed portions of chips, such as its edges, and is not deposited on masked portions of chips, such as bond pads.
公开日期2010-08-31
申请日期2007-05-22
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/38357]  
专题半导体激光器专利数据库
作者单位AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
推荐引用方式
GB/T 7714
MCCOLLOCH, LAURENCE RAY. Method for making semiconductor chips having coated portions. US7785924. 2010-08-31.
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