Method for making semiconductor chips having coated portions | |
MCCOLLOCH, LAURENCE RAY | |
2010-08-31 | |
著作权人 | AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. |
专利号 | US7785924 |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Method for making semiconductor chips having coated portions |
英文摘要 | A method for making semiconductor chips having coated portions can include mounting the chips in lead frames, stacking the lead frames in an orientation in which a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating, and depositing a coating on the stacked lead frames using, for example, an evaporative coating machine. In this manner, the coating is deposited on exposed portions of chips, such as its edges, and is not deposited on masked portions of chips, such as bond pads. |
公开日期 | 2010-08-31 |
申请日期 | 2007-05-22 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/38357] |
专题 | 半导体激光器专利数据库 |
作者单位 | AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. |
推荐引用方式 GB/T 7714 | MCCOLLOCH, LAURENCE RAY. Method for making semiconductor chips having coated portions. US7785924. 2010-08-31. |
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