| System and method for laser assisted bonding of semiconductor die | |
| YOON, TAE HO; JUNG, YANG GYOO; KIM, MIN HO; SONG, YOUN SEOK; RYU, DONG SOO; KIM, CHOONG HOE | |
| 2019-05-28 | |
| 著作权人 | AMKOR TECHNOLOGY, INC |
| 专利号 | US10304698 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | System and method for laser assisted bonding of semiconductor die |
| 英文摘要 | A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate. |
| 公开日期 | 2019-05-28 |
| 申请日期 | 2018-03-13 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38070]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AMKOR TECHNOLOGY, INC |
| 推荐引用方式 GB/T 7714 | YOON, TAE HO,JUNG, YANG GYOO,KIM, MIN HO,et al. System and method for laser assisted bonding of semiconductor die. US10304698. 2019-05-28. |
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