Photonic integrated circuit
KOJIMA, KEISUKE; NISHIKAWA, SATOSHI; KOIKE-AKINO, TOSHIAKI; WANG, BINGNAN; YAGYU, EIJI
2018-11-06
著作权人MITSUBISHI ELECTRIC CORPORATION
专利号US10120132
国家美国
文献子类授权发明
其他题名Photonic integrated circuit
英文摘要A photonic integrated circuit having discrete optical components arranged on a top side of a substrate includes a first and second optical sources respectively configured to emit light beams, a first interferometer having a first and second input ports respectively coupled to the first and second optical sources via first waveguides, a second interferometer configured to receive signals from the first interferometer via second waveguides and combine the signals to transmit a combined signal via a third waveguide, and a submount configured to contact a back side of the substrate, wherein the submount includes a first thermal conductor having a first thermal conductivity and a second conductor having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity, and the first and second optical sources are more proximity to the first thermal conductor than the second thermal conductor.
公开日期2018-11-06
申请日期2017-03-30
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/37983]  
专题半导体激光器专利数据库
作者单位MITSUBISHI ELECTRIC CORPORATION
推荐引用方式
GB/T 7714
KOJIMA, KEISUKE,NISHIKAWA, SATOSHI,KOIKE-AKINO, TOSHIAKI,et al. Photonic integrated circuit. US10120132. 2018-11-06.
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