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	Package structures and methods of forming the same
	HOU, HAO-CHENG; LIU, MING-CHE; CHUANG, CHUN-CHIH; CHENG, JUNG WEI; WANG, TSUNG-DING; LIN, HUNG-JEN
	2017-02-07
著作权人	TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
专利号	US9564416
国家	美国
文献子类	授权发明
其他题名	Package structures and methods of forming the same
英文摘要	Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant. The second die is attached by an external electrical connector to the redistribution structure. The second die is on an opposite side of the redistribution structure from the first die. A second encapsulant is on the redistribution structure and at least laterally encapsulates the second die. The second encapsulant has a surface distal from the redistribution structure. A conductive feature extends from the redistribution structure through the second encapsulant to the surface of the second encapsulant. A conductive pillar is on the conductive feature, and the conductive pillar protrudes from the surface of the second encapsulant.
公开日期	2017-02-07
申请日期	2015-04-24
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37816]
专题	半导体激光器专利数据库
作者单位	TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
推荐引用方式 GB/T 7714	HOU, HAO-CHENG,LIU, MING-CHE,CHUANG, CHUN-CHIH,et al. Package structures and methods of forming the same. US9564416. 2017-02-07.

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