| Light converter assemblies with enhanced heat dissipation | |
| ANC, MARIA; LENEF, ALAN | |
| 2019-08-06 | |
| 著作权人 | OSRAM OPTO SEMICONDUCTORS GMBH |
| 专利号 | US10374137 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Light converter assemblies with enhanced heat dissipation |
| 英文摘要 | The present disclosure is directed to light converter assemblies with enhanced heat dissipation. A light converter assembly may comprise a confinement material applied to at least a first substrate and a phosphor material also deposited on the first substrate so as to be surrounded by the confinement material. The first substrate may be hermetically sealed to a second substrate using the confinement material so that the phosphor material is confined between the substrates and protected from atmospheric contamination. The substrates may comprise, for example, sapphire to allow for light beam transmission and heat conductance. Confinement materials that may be employed to seal the first substrate to the second substrate may include, for example, silicon or a metal (e.g., silver, copper, aluminum, etc.) The phosphor material may comprise, for example, at least one quantum dot material. |
| 公开日期 | 2019-08-06 |
| 申请日期 | 2015-03-10 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37808]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OSRAM OPTO SEMICONDUCTORS GMBH |
| 推荐引用方式 GB/T 7714 | ANC, MARIA,LENEF, ALAN. Light converter assemblies with enhanced heat dissipation. US10374137. 2019-08-06. |
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