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	Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
	BOLKEN, TODD O.; COBBLEY, CHAD A.
	2014-01-07
著作权人	ROUND ROCK RESEARCH, LLC
专利号	US8624371
国家	美国
文献子类	授权发明
其他题名	Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
英文摘要	Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
公开日期	2014-01-07
申请日期	2013-04-19
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37667]
专题	半导体激光器专利数据库
作者单位	ROUND ROCK RESEARCH, LLC
推荐引用方式 GB/T 7714	BOLKEN, TODD O.,COBBLEY, CHAD A.. Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor. US8624371. 2014-01-07.

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