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	Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate
	SEO, KI HO; KIM, TAE HOON; SHIN, SANG HYUN; HEO, CHEOL HO; LEE, YOUNG KI; PARK, JI HYUN
	2013-02-05
著作权人	SAMSUNG ELECTRO-MECHANICS CO., LTD.
专利号	US8368291
国家	美国
文献子类	授权发明
其他题名	Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate
英文摘要	The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.
公开日期	2013-02-05
申请日期	2010-12-09
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37486]
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRO-MECHANICS CO., LTD.
推荐引用方式 GB/T 7714	SEO, KI HO,KIM, TAE HOON,SHIN, SANG HYUN,et al. Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate. US8368291. 2013-02-05.

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