Semiconductor device assembly
YALAMANCHILI, PRASAD; QIU, XIANGDONG; RAJU, REDDY; SKIDMORE, JAY A.; AU, MICHAEL; ZAVALA, LAURA; DUESTERBERG, RICHARD L.
2013-07-02
著作权人LUMENTUM OPERATIONS LLC
专利号US8475056
国家美国
文献子类授权发明
其他题名Semiconductor device assembly
英文摘要A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.
公开日期2013-07-02
申请日期2010-07-26
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/37471]  
专题半导体激光器专利数据库
作者单位LUMENTUM OPERATIONS LLC
推荐引用方式
GB/T 7714
YALAMANCHILI, PRASAD,QIU, XIANGDONG,RAJU, REDDY,et al. Semiconductor device assembly. US8475056. 2013-07-02.
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