QQ客服 官方微博 反馈留言

	Active solid heatsink device and fabricating method thereof
	YU, CHIH-KUANG; LIU, CHUN-KAI; DAI, MING-JI; CHENG, CHIH-YUAN
	2012-07-17
著作权人	INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
专利号	US8222728
国家	美国
文献子类	授权发明
其他题名	Active solid heatsink device and fabricating method thereof
英文摘要	An active solid heatsink device and fabricating method thereof is related to a high-effective solid cooling device, where heat generated by a heat source with a small area and a high heat-generating density diffuses to a whole substrate using a heat conduction characteristic of hot electrons of a thermionic (TI) structure, and the thermionic (TI) structure and a thermo-electric (TE) structure share the substrate where the heat diffuses to. Further, the shared substrate serves as a cold end of the TE structure, and the heat diffusing to the shared substrate is pumped to another substrate of the TE structure serving as a hot end of the TE structure.
公开日期	2012-07-17
申请日期	2008-12-16
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37401]
专题	半导体激光器专利数据库
作者单位	INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
推荐引用方式 GB/T 7714	YU, CHIH-KUANG,LIU, CHUN-KAI,DAI, MING-JI,et al. Active solid heatsink device and fabricating method thereof. US8222728. 2012-07-17.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。