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	High-frequency circuit and its module for communication devices
	SHIMIZU, JUNICHI
	2003-01-14
著作权人	RENESAS ELECTRONICS CORPORATION
专利号	US6507111
国家	美国
文献子类	授权发明
其他题名	High-frequency circuit and its module for communication devices
英文摘要	A high-frequency circuit is provided, which makes it possible to prevent degradation of its high-frequency characteristic even if the lengths of bonding wires used are not decreased. This circuit includes: (a) an electronic element having a capacitance; (b) a signal line for transmitting a high-frequency electric signal to the element; (c) a terminating resistor for impedance matching; (d) a first bonding wire for electrically connecting the signal line and the element; and (e) a second bonding wire for electrically connecting the element and the resistor. A characteristic impedance of combination of the element and the first and second bonding wires is equal to or greater than that of input side of the electric signal with respect to the combination. An inductance of the second wire is greater than that of the first wire. Preferably, at least one of the lengths of the first and second bonding wires is decreased, which enhances the advantage of the high-frequency circuit.
公开日期	2003-01-14
申请日期	2001-04-25
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36745]
专题	半导体激光器专利数据库
作者单位	RENESAS ELECTRONICS CORPORATION
推荐引用方式 GB/T 7714	SHIMIZU, JUNICHI. High-frequency circuit and its module for communication devices. US6507111. 2003-01-14.

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