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	Heat sink for semiconductor devices
	RAYMOND, M., CRAIG; JAMES, W., CROWE; EARL, L., WILKIE
	1970-11-11
著作权人	INTERNATIONAL BUSINESS MACHINES CORPORATION
专利号	GB1211663A
国家	英国
文献子类	授权发明
其他题名	Heat sink for semiconductor devices
英文摘要	1,211,663. Electroluminescence. INTERNATIONAL BUSINESS MACHINES CORP. 28 Feb., 1969, No. 10802/69. Heading C4S. [Also in Division H1] A semi-conductor device with plane electrodes is mounted between two rigid blocks which together form a heat sink for the device and which have plane surfaces in contact with the electrodes; the two blocks are held together, by an insulating bonding material between them. The embodiment shown is an injection] laser, consisting of two PN diodes in a single semi-conductor body 22; these are connected in parallel by the upper block 12B. The blocks, which are provided with grooves 14A to allow the egress of light, may consist of molybdenum, copper, silver or tungsten. The bonding material 30, 32 may be any thermoplastic, or thermosetting material; black wax and glycol thiolate are mentioned but epoxy resin is preferred. To assemble the structure the contact surfaces of the laser and blocks are indium coated, the lower block 12A with the semi-conductor body and uncured epoxy resin thereon is placed on a rigid table, andthe upper block 12B put on initially on aslant so as to rest on one diode portion only-a stylus is then used to apply pressure directly downward on the mid-point of the block to rotate the upper block into full contact with the upper surface of the semiconductor body; this ensures that uniform pressure is applied across the body even it its surfaces are not parallel. Sufficient pressure is applied to form cold-pressure bonds. The epoxy resin is then hardened; it contracts slightly as it does. and maintains pressure in the completed device. (The intensity and frequency of emitted light is stated to be pressure and temperature dependent).
公开日期	1970-11-11
申请日期	1969-02-28
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/35685]
专题	半导体激光器专利数据库
作者单位	INTERNATIONAL BUSINESS MACHINES CORPORATION
推荐引用方式 GB/T 7714	RAYMOND, M., CRAIG,JAMES, W., CROWE,EARL, L., WILKIE. Heat sink for semiconductor devices. GB1211663A. 1970-11-11.

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