| Laser diode package | |
| WU, JIAHN-CHANG | |
| 1999-12-28 | |
| 著作权人 | WANG, BILLY |
| 专利号 | US6008529 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Laser diode package |
| 英文摘要 | A surface mount semiconductor laser diode package has a substrate on which the laser diode is mounted. The top electrode of the laser diode is wire-bonded to the top end of a plated-through conduit through the substrate, and the bottom end of the plated-through conduit is connected to a circuit contact plated at the bottom surface of the substrate. The bottom electrode of the laser diode is flip-chip mounted to the top end of another plated-through conduit, and bottom end of the second plated-through conduit is connected to a second circuit contact. Each laser diode is covered with a transparent lid or a lid with a lens. For mass production, a large number of the laser diodes arranged in a matrix formation are mounted on a common substrate. Walls are erected around each laser diode. A transparent cover is placed over the walls. All the plated-through conduits at the edges of the laser diodes in a same column are aligned and sawed through together. |
| 公开日期 | 1999-12-28 |
| 申请日期 | 1998-06-25 |
| 状态 | 失效 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35245]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | WANG, BILLY |
| 推荐引用方式 GB/T 7714 | WU, JIAHN-CHANG. Laser diode package. US6008529. 1999-12-28. |
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