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	Optical device package and optical semiconductor device using the same
	FUJINO, JUNJI; TANAKA, HIDEYUKI; MORI, KENZO
	2011-01-25
著作权人	MITSUBISHI ELECTRIC CORPORATION
专利号	US7875901
国家	美国
文献子类	授权发明
其他题名	Optical device package and optical semiconductor device using the same
英文摘要	An optical device package comprises: a metal frame including a substrate and a rectangular die pad portion integrally connected to the substrate, wherein the substrate is a metal plate, and the die pad portion is bent from the substrate such that the die pad portion extends from the substrate at an angle of 90 degrees; signal lead pins extend in the opposite directions from the die pad portion relative to the substrate such that the first lead pins intersect the principal surfaces of the substrate at a right angle and are spaced apart from the metal frame; and a molded resin member including a plate-like resin base extending across and in contact with one of the principal surfaces of the substrate, wherein the signal lead pins protrude from a surface of the resin base; surfaces of the signal lead pins are covered with the molded resin member; and the metal frame and the signal lead pins are secured in place by the molded resin member.
公开日期	2011-01-25
申请日期	2009-10-07
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/34045]
专题	半导体激光器专利数据库
作者单位	MITSUBISHI ELECTRIC CORPORATION
推荐引用方式 GB/T 7714	FUJINO, JUNJI,TANAKA, HIDEYUKI,MORI, KENZO. Optical device package and optical semiconductor device using the same. US7875901. 2011-01-25.

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