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	Chip on carrier
	MU, JIANWEI; DING, FRANK LEI; WU, TAO; DENG, HONGYU; AMIRKIAI, MAZIAR
	2019-08-06
著作权人	FINISAR CORPORATION
专利号	US10374386
国家	美国
文献子类	授权发明
其他题名	Chip on carrier
英文摘要	A chip may include a first substantially planar isolation layer with a first surface and a second surface opposite the first surface. The chip may include a first substantially planar conduction layer with a first surface positioned adjacent to the second surface of the first isolation layer and a second surface opposite the first surface. The chip may include a second substantially planar isolation layer with a first surface positioned adjacent to the second surface of the first conduction layer and a second surface opposite the first surface. The chip may include a second conduction layer etched on the second surface of the second isolation layer. The second conduction layer may include an anode trace, a cathode trace, and an optical transmitter positioned on the cathode trace. The chip may include one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer.
公开日期	2019-08-06
申请日期	2018-06-07
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/32375]
专题	半导体激光器专利数据库
作者单位	FINISAR CORPORATION
推荐引用方式 GB/T 7714	MU, JIANWEI,DING, FRANK LEI,WU, TAO,et al. Chip on carrier. US10374386. 2019-08-06.

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