Influence of operation conditions on deposition rate of planar DC magnetron sputtering | |
Qiu, Qingquan; Li, Qingfu; Su, Jingjing; Jiao, Yu; Jim, Finley | |
刊名 | Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology
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2009 | |
卷号 | 29期号:1页码:46-51 |
关键词 | Dc magnetron sputtering Discharge currents Operation conditions Plasma impedance Provide guidances Simulation Sputtering conditions Target-substrate |
ISSN号 | 1672-7126 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4819558 |
专题 | 西安交通大学 |
推荐引用方式 GB/T 7714 | Qiu, Qingquan,Li, Qingfu,Su, Jingjing,et al. Influence of operation conditions on deposition rate of planar DC magnetron sputtering[J]. Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology,2009,29(1):46-51. |
APA | Qiu, Qingquan,Li, Qingfu,Su, Jingjing,Jiao, Yu,&Jim, Finley.(2009).Influence of operation conditions on deposition rate of planar DC magnetron sputtering.Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology,29(1),46-51. |
MLA | Qiu, Qingquan,et al."Influence of operation conditions on deposition rate of planar DC magnetron sputtering".Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology 29.1(2009):46-51. |
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