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	Ceramic-Metal Composite Filler for Thermally Conductive Underfill
	Tuan, Chia-Chi; Lian, Gang; Moon, Kyoung-Sik; Wong, Ching-Ping
刊名	2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
	2016
卷号	2016-August页码:743-748
关键词	underfill thermal conductivity aluminum metal ceramic
DOI	10.1109/ECTC.2016.284
会议名称	66th IEEE Electronic Components and Technology Conference (ECTC)
URL标识	查看原文
会议日期	MAY 31-JUN 03, 2016
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4760105
专题	山东大学
作者单位	1.Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA. 2.Shan
推荐引用方式 GB/T 7714	Tuan, Chia-Chi,Lian, Gang,Moon, Kyoung-Sik,et al. Ceramic-Metal Composite Filler for Thermally Conductive Underfill[J]. 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC),2016,2016-August:743-748.
APA	Tuan, Chia-Chi,Lian, Gang,Moon, Kyoung-Sik,&Wong, Ching-Ping.(2016).Ceramic-Metal Composite Filler for Thermally Conductive Underfill.2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC),2016-August,743-748.
MLA	Tuan, Chia-Chi,et al."Ceramic-Metal Composite Filler for Thermally Conductive Underfill".2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 2016-August(2016):743-748.

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