| Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics | |
| Li, Cai-Fu; Li, Wanli; Zhang, Hao; Liu, Jinting; Yang, Yang; Li, Lingying; Gao, Yue; Liu, Zhi-Quan; Suganuma, Katsuaki | |
| 刊名 | ACS APPLIED MATERIALS & INTERFACES
 |
| 2019 | |
| 卷号 | Vol.11 No.3页码:3231-3240 |
| 关键词 | conductive pastes stretchable wirings stretchable bonding Ag microflakes recoverability |
| ISSN号 | 1944-8244 |
| URL标识 | 查看原文 |
| 公开日期 | [db:dc_date_available] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4744080 |
| 专题 | 湖南大学 |
| 作者单位 | 1.Osaka Univ, Inst Sci & Ind Res, Ibaraki 5670047, Japan 2.Osaka Univ, Grad Sch Engn, Dept Adapt Machine Syst, Suita, Osaka 5650871, Japan 3.Senju Met Ind Co Ltd, Tokyo 1208555, Japan 4.Pacific Northwest Natl Lab, Richland, WA 99354 USA 5.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China |
| 推荐引用方式 GB/T 7714 | Li, Cai-Fu,Li, Wanli,Zhang, Hao,et al. Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics[J]. ACS APPLIED MATERIALS & INTERFACES,2019,Vol.11 No.3:3231-3240. |
| APA | Li, Cai-Fu.,Li, Wanli.,Zhang, Hao.,Liu, Jinting.,Yang, Yang.,...&Suganuma, Katsuaki.(2019).Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics.ACS APPLIED MATERIALS & INTERFACES,Vol.11 No.3,3231-3240. |
| MLA | Li, Cai-Fu,et al."Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics".ACS APPLIED MATERIALS & INTERFACES Vol.11 No.3(2019):3231-3240. |
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