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	Improving the quality of Schottky contacts on ZnO microwires using Cu-contained silver paste electrode
	Qiu, Yu; Zhang, Heqiu; Hu, Lizhong; Wang, Lina; Wang, Bin; Yang, Dechao; Liu, Guoqiang; Ji, Jiuyu; Liu, Xin; Lin, Jianfang
刊名	MICRO & NANO LETTERS
	2012
卷号	7页码:592-595
ISSN号	1750-0443
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4668766
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Phys & Optoelect Technol, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Qiu, Yu,Zhang, Heqiu,Hu, Lizhong,et al. Improving the quality of Schottky contacts on ZnO microwires using Cu-contained silver paste electrode[J]. MICRO & NANO LETTERS,2012,7:592-595.
APA	Qiu, Yu.,Zhang, Heqiu.,Hu, Lizhong.,Wang, Lina.,Wang, Bin.,...&Han, Shijun.(2012).Improving the quality of Schottky contacts on ZnO microwires using Cu-contained silver paste electrode.MICRO & NANO LETTERS,7,592-595.
MLA	Qiu, Yu,et al."Improving the quality of Schottky contacts on ZnO microwires using Cu-contained silver paste electrode".MICRO & NANO LETTERS 7(2012):592-595.

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