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	Multiscale concurrent topology optimization of structures and microscopic multi-phase materials for thermal conductivity.
	Da, Daicong; Cui, Xiangyang; Long, Kai; Cai, Yong; Li, Guangyao
刊名	Engineering Computations
	2019
卷号	Vol.36 No.1页码:126-146
ISSN号	0264-4401
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4617410
专题	湖南大学
作者单位	1.State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, Changsha, China and Joint Center for Intelligent New Energy Vehicle, Shanghai, China 2.State Key Laboratory for Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing, China
推荐引用方式 GB/T 7714	Da, Daicong,Cui, Xiangyang,Long, Kai,et al. Multiscale concurrent topology optimization of structures and microscopic multi-phase materials for thermal conductivity.[J]. Engineering Computations,2019,Vol.36 No.1:126-146.
APA	Da, Daicong,Cui, Xiangyang,Long, Kai,Cai, Yong,&Li, Guangyao.(2019).Multiscale concurrent topology optimization of structures and microscopic multi-phase materials for thermal conductivity..Engineering Computations,Vol.36 No.1,126-146.
MLA	Da, Daicong,et al."Multiscale concurrent topology optimization of structures and microscopic multi-phase materials for thermal conductivity.".Engineering Computations Vol.36 No.1(2019):126-146.

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