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	Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga-In-Sn Alloy Melt on Cu Substrate
	Zhang, Limin; Li, Ning; Xing, Hui; Zhang, Rong; Song, Kaikai
刊名	ADVANCES IN CONDENSED MATTER PHYSICS
	2018
DOI	10.1155/2018/6328976
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4569621
专题	山东大学
作者单位	Northwestern Polytech Univ, Sch Sci, Minist Educ, Shaanxi Key Lab Condensed Matter Struct & Propert,
推荐引用方式 GB/T 7714	Zhang, Limin,Li, Ning,Xing, Hui,et al. Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga-In-Sn Alloy Melt on Cu Substrate[J]. ADVANCES IN CONDENSED MATTER PHYSICS,2018.
APA	Zhang, Limin,Li, Ning,Xing, Hui,Zhang, Rong,&Song, Kaikai.(2018).Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga-In-Sn Alloy Melt on Cu Substrate.ADVANCES IN CONDENSED MATTER PHYSICS.
MLA	Zhang, Limin,et al."Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga-In-Sn Alloy Melt on Cu Substrate".ADVANCES IN CONDENSED MATTER PHYSICS (2018).

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