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Deposition behavior of thermally softened copper particles in cold spraying
Yin, Shuo; Wang, Xiaofang; Suo, Xinkun; Liao, Hanlin; Guo, Zhiwei; Li, Wenya; Coddet, Christian
刊名ACTA MATERIALIA
2013
卷号61页码:5105-5118
关键词Cold spraying (CS) Deposition behavior Particle preheating Thermal softening Numerical simulation
ISSN号1359-6454
URL标识查看原文
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/4540653
专题大连理工大学
作者单位1.Dalian Univ Technol, Sch Energy & Power Engn, Dalian 116024, Liaoning, Peoples R China.
2.Univ Technol Belfort Montbeliard, LERMPS, F-90010 Belfort, France.
3.Dalian Univ Technol, Sch Energy & Power Engn, Dalian 116024, Liaoning, Peoples R China.
4.Univ Technol Belfort Montbeliard, LERMPS, F-90010 Belfort, France.
5.Northwestern Polytech Univ, Sch Mat Sci & Engn, Shaanxi Key Lab Frict Welding Technol, Xian 710072, Shaanxi, Peoples R China.
推荐引用方式
GB/T 7714
Yin, Shuo,Wang, Xiaofang,Suo, Xinkun,et al. Deposition behavior of thermally softened copper particles in cold spraying[J]. ACTA MATERIALIA,2013,61:5105-5118.
APA Yin, Shuo.,Wang, Xiaofang.,Suo, Xinkun.,Liao, Hanlin.,Guo, Zhiwei.,...&Coddet, Christian.(2013).Deposition behavior of thermally softened copper particles in cold spraying.ACTA MATERIALIA,61,5105-5118.
MLA Yin, Shuo,et al."Deposition behavior of thermally softened copper particles in cold spraying".ACTA MATERIALIA 61(2013):5105-5118.
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