Deposition behavior of thermally softened copper particles in cold spraying | |
Yin, Shuo; Wang, Xiaofang; Suo, Xinkun; Liao, Hanlin; Guo, Zhiwei; Li, Wenya; Coddet, Christian | |
刊名 | ACTA MATERIALIA |
2013 | |
卷号 | 61页码:5105-5118 |
关键词 | Cold spraying (CS) Deposition behavior Particle preheating Thermal softening Numerical simulation |
ISSN号 | 1359-6454 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4540653 |
专题 | 大连理工大学 |
作者单位 | 1.Dalian Univ Technol, Sch Energy & Power Engn, Dalian 116024, Liaoning, Peoples R China. 2.Univ Technol Belfort Montbeliard, LERMPS, F-90010 Belfort, France. 3.Dalian Univ Technol, Sch Energy & Power Engn, Dalian 116024, Liaoning, Peoples R China. 4.Univ Technol Belfort Montbeliard, LERMPS, F-90010 Belfort, France. 5.Northwestern Polytech Univ, Sch Mat Sci & Engn, Shaanxi Key Lab Frict Welding Technol, Xian 710072, Shaanxi, Peoples R China. |
推荐引用方式 GB/T 7714 | Yin, Shuo,Wang, Xiaofang,Suo, Xinkun,et al. Deposition behavior of thermally softened copper particles in cold spraying[J]. ACTA MATERIALIA,2013,61:5105-5118. |
APA | Yin, Shuo.,Wang, Xiaofang.,Suo, Xinkun.,Liao, Hanlin.,Guo, Zhiwei.,...&Coddet, Christian.(2013).Deposition behavior of thermally softened copper particles in cold spraying.ACTA MATERIALIA,61,5105-5118. |
MLA | Yin, Shuo,et al."Deposition behavior of thermally softened copper particles in cold spraying".ACTA MATERIALIA 61(2013):5105-5118. |
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