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	Influence of diffusion and deposition processes on the electrochemical formation of gold amalgam
	Wang, Nan; Huang, Zixu; Jiang, Chunbo; Xu, Fei; Liu, Gang; Liu, Xingcen; Sun, Shengjun; Dai, Hongxiu; Ma, Houyi; Lin, Meng
刊名	COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
	2019
卷号	573页码:165-169
关键词	Gold nanorods Diffusion Deposition Amalgam
DOI	10.1016/j.colsurfa.2019.04.061
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4531382
专题	山东大学
作者单位	Shandong Univ, Sch Chem & Chem Engn, State Educ Minist, Key Lab Collo
推荐引用方式 GB/T 7714	Wang, Nan,Huang, Zixu,Jiang, Chunbo,et al. Influence of diffusion and deposition processes on the electrochemical formation of gold amalgam[J]. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS,2019,573:165-169.
APA	Wang, Nan.,Huang, Zixu.,Jiang, Chunbo.,Xu, Fei.,Liu, Gang.,...&Lin, Meng.(2019).Influence of diffusion and deposition processes on the electrochemical formation of gold amalgam.COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS,573,165-169.
MLA	Wang, Nan,et al."Influence of diffusion and deposition processes on the electrochemical formation of gold amalgam".COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS 573(2019):165-169.

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