| Effect of Cu on Interfacial Reaction in High-lead Solder Bumps | |
| Xu, Liwei; Huang, Mingliang; Yao, Quanbin; Wang, Yong; Lian, Binhao | |
| 2015 | |
| 会议名称 | 16 int conf elect packaging technology |
| 会议日期 | 2015-08-11 |
| 会议地点 | Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA |
| 关键词 | Sn-Pb-Cu Solder bump Interfacial reaction Mechanical property Intermetallic compound |
| 页码 | 1279-1282 |
| 会议录 | 16 int conf elect packaging technology
 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4408409 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Lab Elect Packaging Mat, Dalian 116024, Peoples R China. 2.Beijing Microelect Technol Inst, Beijing 100076, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Xu, Liwei,Huang, Mingliang,Yao, Quanbin,et al. Effect of Cu on Interfacial Reaction in High-lead Solder Bumps[C]. 见:16 int conf elect packaging technology. Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA. 2015-08-11. |
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