| Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation | |
| Wang, Tongmin; Zhou, Peng; Cao, Fei; Kang, Huijun; Chen, Zongning; Fu, Yanan; Xiao, Tiqiao; Huang, Wanxia; Yuan, Qingxi | |
| 刊名 | INTERMETALLICS
 |
| 2015 | |
| 卷号 | 58页码:84-90 |
| 关键词 | In situ X-ray Intermetallics Crystal growth Microstructure |
| ISSN号 | 0966-9795 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4405963 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China. 2.Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai 201204, Peoples R China. 3.Chinese Acad Sci, Inst High Energy Phys, Beijing 100039, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, Tongmin,Zhou, Peng,Cao, Fei,et al. Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation[J]. INTERMETALLICS,2015,58:84-90. |
| APA | Wang, Tongmin.,Zhou, Peng.,Cao, Fei.,Kang, Huijun.,Chen, Zongning.,...&Yuan, Qingxi.(2015).Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation.INTERMETALLICS,58,84-90. |
| MLA | Wang, Tongmin,et al."Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation".INTERMETALLICS 58(2015):84-90. |
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