Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology | |
Liu, Shengfa; Zhang, Dongxiao; Xiong, Jieran; Chen, Chen; Song, Tianjie; Liu, Li; Huang, Shangyu | |
刊名 | Journal of Alloys and Compounds
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2019 | |
卷号 | 781 |
ISSN号 | 0925-8388 |
DOI | 10.1016/j.jallcom.2018.12.073 |
URL标识 | 查看原文 |
收录类别 | EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4232028 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Liu, Shengfa,Zhang, Dongxiao,Xiong, Jieran,et al. Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology[J]. Journal of Alloys and Compounds,2019,781. |
APA | Liu, Shengfa.,Zhang, Dongxiao.,Xiong, Jieran.,Chen, Chen.,Song, Tianjie.,...&Huang, Shangyu.(2019).Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology.Journal of Alloys and Compounds,781. |
MLA | Liu, Shengfa,et al."Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology".Journal of Alloys and Compounds 781(2019). |
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