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	Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation
	Meng, Binbin; Yuan, Dandan; Xu, Shaolin
刊名	International Journal of Mechanical Sciences
	2019
卷号	151
ISSN号	0020-7403
DOI	10.1016/j.ijmecsci.2018.12.022
URL标识	查看原文
收录类别	EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4230933
专题	武汉大学
推荐引用方式 GB/T 7714	Meng, Binbin,Yuan, Dandan,Xu, Shaolin. Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation[J]. International Journal of Mechanical Sciences,2019,151.
APA	Meng, Binbin,Yuan, Dandan,&Xu, Shaolin.(2019).Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation.International Journal of Mechanical Sciences,151.
MLA	Meng, Binbin,et al."Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation".International Journal of Mechanical Sciences 151(2019).

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