Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale | |
Meng, Binbin; Yuan, Dandan; Xu, Shaolin | |
刊名 | CERAMICS INTERNATIONAL |
2019 | |
卷号 | 45期号:2 |
关键词 | SiC Coupling effect Deformation Molecular dynamics |
ISSN号 | 0272-8842 |
DOI | 10.1016/j.ceramint.2018.10.175 |
URL标识 | 查看原文 |
收录类别 | SCIE |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4217424 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Meng, Binbin,Yuan, Dandan,Xu, Shaolin. Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale[J]. CERAMICS INTERNATIONAL,2019,45(2). |
APA | Meng, Binbin,Yuan, Dandan,&Xu, Shaolin.(2019).Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale.CERAMICS INTERNATIONAL,45(2). |
MLA | Meng, Binbin,et al."Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale".CERAMICS INTERNATIONAL 45.2(2019). |
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