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	Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments
	Cai, Yang; Wang, Yu; Liu, Di; Zhao, Fu-Yun
刊名	APPLIED THERMAL ENGINEERING
	2019
卷号	148
关键词	Thermoelectric cooling Electronic heat removal Thermo-physical parameters Analytical solutions Evaluation index for cooling performance
ISSN号	1359-4311
DOI	10.1016/j.applthermaleng.2018.11.014
URL标识	查看原文
收录类别	EI ; SCIE
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4215835
专题	武汉大学
推荐引用方式 GB/T 7714	Cai, Yang,Wang, Yu,Liu, Di,et al. Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments[J]. APPLIED THERMAL ENGINEERING,2019,148.
APA	Cai, Yang,Wang, Yu,Liu, Di,&Zhao, Fu-Yun.(2019).Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments.APPLIED THERMAL ENGINEERING,148.
MLA	Cai, Yang,et al."Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments".APPLIED THERMAL ENGINEERING 148(2019).

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