| Contact Resistance Model and Thermal Stability Analysis of Bolt Structure | |
| Wu, Yongcong; Ruan, Jiangjun; Gong, Yujia; Long, Mingyang; Li, Peng | |
| 刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
 |
| 2019 | |
| 卷号 | 9期号:4 |
| 关键词 | Bolt structure contact resistance model thermal stability analysis virtual material method |
| ISSN号 | 2156-3950 |
| DOI | 10.1109/TCPMT.2018.2877774 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE |
| 语种 | 英语 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4214796 |
| 专题 | 武汉大学 |
| 推荐引用方式 GB/T 7714 | Wu, Yongcong,Ruan, Jiangjun,Gong, Yujia,et al. Contact Resistance Model and Thermal Stability Analysis of Bolt Structure[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2019,9(4). |
| APA | Wu, Yongcong,Ruan, Jiangjun,Gong, Yujia,Long, Mingyang,&Li, Peng.(2019).Contact Resistance Model and Thermal Stability Analysis of Bolt Structure.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,9(4). |
| MLA | Wu, Yongcong,et al."Contact Resistance Model and Thermal Stability Analysis of Bolt Structure".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 9.4(2019). |
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