Current-induced growth of P-rich phase at electroless nickel/Sn interface

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	Current-induced growth of P-rich phase at electroless nickel/Sn interface
	Q. L. Yang ; P. J. Shang ; J. D. Guo ; Z. Q. Liu ; J. K. Shang
刊名	Journal of Materials Research
	2009
卷号	24 期号:9 页码:2767-2774
关键词	intermetallic compound formation under-bump metallization sn-ag solder ni-p sn-3.5ag solder shear-strength metallurgical reaction mechanical strength phosphorus-content thermal-stability
ISSN号	0884-2914
中文摘要	The role of high current stressing during growth of the P-rich phase at the electroless Ni/Sn interface was examined by transmission electron microscopy. Prior to current stressing, two layers of Ni(12)P(5), columnar Ni(12)P(5) and noncolumnar Ni(12)P(5), were formed after soldering. Upon electric stressing, the two layers of P-rich phase showed opposite growth patterns at the two opposing electrode interfaces. At the cathode, columnar growth of the P-rich phase was greatly enhanced while growth of the noncolumnar layer was inhibited. By contrast, the opposite was found at the anode where the current stressing promoted the noncolumnar growth but suppressed the growth of the columnar layer. Such a strong polarity effect resulted from directional electromigration of the key reaction species, nickel, to and from the interfacial reaction fronts. As a result of the difference in reaction mechanism, overall growth of the P-rich phase was much faster at the cathode during current stressing.
原文出处	://WOS:000269585300004
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://210.72.142.130/handle/321006/32492]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. L. Yang,P. J. Shang,J. D. Guo,et al. Current-induced growth of P-rich phase at electroless nickel/Sn interface[J]. Journal of Materials Research,2009,24(9):2767-2774.
APA	Q. L. Yang,P. J. Shang,J. D. Guo,Z. Q. Liu,&J. K. Shang.(2009).Current-induced growth of P-rich phase at electroless nickel/Sn interface.Journal of Materials Research,24(9),2767-2774.
MLA	Q. L. Yang,et al."Current-induced growth of P-rich phase at electroless nickel/Sn interface".Journal of Materials Research 24.9(2009):2767-2774.