THERMOPILE IR DETECTOR WITH FILTER COINTEGRATED BY WAFER BONDING TECHNIQUE

	THERMOPILE IR DETECTOR WITH FILTER COINTEGRATED BY WAFER BONDING TECHNIQUE
	Xu,DH ; Xiong,B ; Jing,ER ; Wu,GQ ; Wang,YL
刊名	2011 IEEE 24TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)
	2011
期号	0 页码:724-727
关键词	IEEE
ISSN号	1084-6999
学科主题	Engineering ; Electrical & Electronic; Nanoscience & Nanotechnology
公开日期	2012-04-12
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/106921]
专题	上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式 GB/T 7714	Xu,DH,Xiong,B,Jing,ER,et al. THERMOPILE IR DETECTOR WITH FILTER COINTEGRATED BY WAFER BONDING TECHNIQUE[J]. 2011 IEEE 24TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS),2011(0):724-727.
APA	Xu,DH,Xiong,B,Jing,ER,Wu,GQ,&Wang,YL.(2011).THERMOPILE IR DETECTOR WITH FILTER COINTEGRATED BY WAFER BONDING TECHNIQUE.2011 IEEE 24TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)(0),724-727.
MLA	Xu,DH,et al."THERMOPILE IR DETECTOR WITH FILTER COINTEGRATED BY WAFER BONDING TECHNIQUE".2011 IEEE 24TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) .0(2011):724-727.