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	A Review of Thermal Transport in Low-Dimensional Materials Under External Perturbation: Effect of Strain, Substrate, and Clustering
	Shao, Cheng; Yu, Xiaoxiang; Yang, Nuo; Yue, Yanan; Bao, Hua
刊名	NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING
	2017
卷号	21期号:4
关键词	Low dimensional materials external perturbation strain substrate effects clustering
ISSN号	1556-7265
DOI	10.1080/15567265.2017.1286421
URL标识	查看原文
收录类别	SCIE ; EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3893019
专题	武汉大学
推荐引用方式 GB/T 7714	Shao, Cheng,Yu, Xiaoxiang,Yang, Nuo,et al. A Review of Thermal Transport in Low-Dimensional Materials Under External Perturbation: Effect of Strain, Substrate, and Clustering[J]. NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING,2017,21(4).
APA	Shao, Cheng,Yu, Xiaoxiang,Yang, Nuo,Yue, Yanan,&Bao, Hua.(2017).A Review of Thermal Transport in Low-Dimensional Materials Under External Perturbation: Effect of Strain, Substrate, and Clustering.NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING,21(4).
MLA	Shao, Cheng,et al."A Review of Thermal Transport in Low-Dimensional Materials Under External Perturbation: Effect of Strain, Substrate, and Clustering".NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING 21.4(2017).

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