Particle size and surfactant effects on chemical mechanical polishing of glass using silica-based slurry
Zhang, ZF ; Liu, WL ; Song, ZT
刊名APPLIED OPTICS
2010
卷号49期号:28页码:5480-5485
关键词SUBSTRATE CMP DIOXIDE PLANARIZATION SAPPHIRE CERIA ACID
ISSN号0003-6935
通讯作者Zhang, ZF, Chinese Acad Sci, State Key Lab Funct Mat Informat, Lab Nanotechnol, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China
学科主题Optics
收录类别SCI
语种英语
公开日期2012-03-24
内容类型期刊论文
源URL[http://ir.sim.ac.cn/handle/331004/94747]  
专题上海微系统与信息技术研究所_功能材料与器件_期刊论文
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Zhang, ZF,Liu, WL,Song, ZT. Particle size and surfactant effects on chemical mechanical polishing of glass using silica-based slurry[J]. APPLIED OPTICS,2010,49(28):5480-5485.
APA Zhang, ZF,Liu, WL,&Song, ZT.(2010).Particle size and surfactant effects on chemical mechanical polishing of glass using silica-based slurry.APPLIED OPTICS,49(28),5480-5485.
MLA Zhang, ZF,et al."Particle size and surfactant effects on chemical mechanical polishing of glass using silica-based slurry".APPLIED OPTICS 49.28(2010):5480-5485.
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