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Effect of droplet spacing & deposition height on Sn conductive lines by pneumatic diaphragm drop-on-demand technology
Zhang, Honghai; Wang, Chunxi; Liao, Daokun; Liu, Sheng; Li, Xiaotian
刊名2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
2016
DOI10.1109/ICEPT.2016.7583410
URL标识查看原文
收录类别EI
语种英语
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/3761012
专题武汉大学
推荐引用方式
GB/T 7714
Zhang, Honghai,Wang, Chunxi,Liao, Daokun,et al. Effect of droplet spacing & deposition height on Sn conductive lines by pneumatic diaphragm drop-on-demand technology[J]. 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016,2016.
APA Zhang, Honghai,Wang, Chunxi,Liao, Daokun,Liu, Sheng,&Li, Xiaotian.(2016).Effect of droplet spacing & deposition height on Sn conductive lines by pneumatic diaphragm drop-on-demand technology.2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016.
MLA Zhang, Honghai,et al."Effect of droplet spacing & deposition height on Sn conductive lines by pneumatic diaphragm drop-on-demand technology".2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016 (2016).
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