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	Three-dimensional on-chip inductor design based on through-silicon vias
	Wang, Gaofeng; Chen, Aobo; Zhao, Si-Qi; Liang, Feng
刊名	Proceedings of International Conference on ASIC
	2013
ISSN号	2162-7541
DOI	10.1109/ASICON.2013.6812066
URL标识	查看原文
收录类别	EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3754747
专题	武汉大学
推荐引用方式 GB/T 7714	Wang, Gaofeng,Chen, Aobo,Zhao, Si-Qi,et al. Three-dimensional on-chip inductor design based on through-silicon vias[J]. Proceedings of International Conference on ASIC,2013.
APA	Wang, Gaofeng,Chen, Aobo,Zhao, Si-Qi,&Liang, Feng.(2013).Three-dimensional on-chip inductor design based on through-silicon vias.Proceedings of International Conference on ASIC.
MLA	Wang, Gaofeng,et al."Three-dimensional on-chip inductor design based on through-silicon vias".Proceedings of International Conference on ASIC (2013).

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