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Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing
Yan, Shiwei; Lei, Yu; Huang, Shangyu*; Wang, Qiong; Zhou, Mengcheng; Hu, Jianhua; Zou, Fangli
刊名International Journal of Applied Electromagnetics and Mechanics
2019
卷号60期号:3页码:457-476
关键词Electromagnetic compaction, dynamic model, optimization study, brazing performance
ISSN号1383-5416
DOI10.3233/JAE-180021
URL标识查看原文
WOS记录号WOS:000470073400010
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/3405845
专题武汉理工大学
作者单位1.[Huang, Shangyu
2.Yan, Shiwei
3.Hu, Jianhua
4.Zhou, Mengcheng
5.Zou, Fangli
6.Lei, Yu] Wuhan Univ Technol, Sch Mat Sci & Engn, 122 Luoshi Rd, Wuhan 430070, Hubei, Peoples R China.
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GB/T 7714
Yan, Shiwei,Lei, Yu,Huang, Shangyu*,et al. Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing[J]. International Journal of Applied Electromagnetics and Mechanics,2019,60(3):457-476.
APA Yan, Shiwei.,Lei, Yu.,Huang, Shangyu*.,Wang, Qiong.,Zhou, Mengcheng.,...&Zou, Fangli.(2019).Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing.International Journal of Applied Electromagnetics and Mechanics,60(3),457-476.
MLA Yan, Shiwei,et al."Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing".International Journal of Applied Electromagnetics and Mechanics 60.3(2019):457-476.
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