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	Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding
	Zhang, Zhenyu; Du, Yuefeng; Wang, Bo; Wang, Ziguang; Kang, Renke; Guo, Dongming
刊名	TRIBOLOGY LETTERS
	2017
卷号	65
关键词	Silicon Nanoscale Wear Transmission electron microscopy Grinding
ISSN号	1023-8883
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3314050
专题	大连理工大学
作者单位	Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Zhang, Zhenyu,Du, Yuefeng,Wang, Bo,et al. Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding[J]. TRIBOLOGY LETTERS,2017,65.
APA	Zhang, Zhenyu,Du, Yuefeng,Wang, Bo,Wang, Ziguang,Kang, Renke,&Guo, Dongming.(2017).Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding.TRIBOLOGY LETTERS,65.
MLA	Zhang, Zhenyu,et al."Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding".TRIBOLOGY LETTERS 65(2017).

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