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	Residual stress modeling and analysis for micro electroforming layer
	Song, Chang; Du, Liqun; Li, Xiaojun; Li, Yuanqi; Qi, Leijie; Li, Yu
刊名	MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
	2017
卷号	23页码:4709-4716
ISSN号	0946-7076
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3313992
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China. 3.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Song, Chang,Du, Liqun,Li, Xiaojun,et al. Residual stress modeling and analysis for micro electroforming layer[J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,2017,23:4709-4716.
APA	Song, Chang,Du, Liqun,Li, Xiaojun,Li, Yuanqi,Qi, Leijie,&Li, Yu.(2017).Residual stress modeling and analysis for micro electroforming layer.MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,23,4709-4716.
MLA	Song, Chang,et al."Residual stress modeling and analysis for micro electroforming layer".MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 23(2017):4709-4716.

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